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The thermal simulation tool for printed circuit boards

Generates results real-time through easy and quick operation in 2D
PICLS is a thermal simulation tool specially designed for thermal simulation of PCBs. PCB modeling can be done easily through simple and quick operation in 2D like E-CAD using layers and PCB manipulating tool. You can import E-CAD data to perform thermal analyses from day 1.

Real-time results

Using typical thermal analysis tools, longer time is required to calculate and attain simulation results. With PICLS, one click and analysis results can be generated real-time. Through simple setting and fast calculation, thermal distribution can be shown on the spot to evaluate effectiveness of thermal countermeasures.

Front loads thermal design processes

PICLS is a simulation tool for designers to perform thermal analyses during upstream design process. Software Cradle’s PICLS is designed to minimize the tasks on design engineers in upstream design phase. Using the tool, design engineers can perform thermal analyses of PCBs during conceptual phase of the development, where drastic design changes are still possible.

High performance

The concept of PICLS is to deliver high capability at low cost. PICLS is a perfect tool that can be installed and maintained without difficulty, which is designed to promote more PCB designers to undertake thermal analyses and achieve better product design.


Thermal countermeasures using PICLS

  • Troubleshooting thermal issues of current products
  • Examining thermal interferences of part layouts
  • Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the performance of a heat sink
  • Examine the size of a PCB
  • Consider heat release changes depending on a wiring pattern (coverage ratio)Examine the arrangement of thermal vias (e.g. location, number)
  • Examine the number of layers and the thickness of copper foil
  • Consider natural/forced air cooling
  • Consider radiant heat
  • Considering heatsinks (number of fins, size
  • Examining heat dissipation performances by connection to enclosure
  • Considering PCB mounting environment


External file interface
・You can import IDF 3.0 and Gerber data

Consideration of simple enclosure
• You can consider heat dissipation by connection to enclosure

• You can allocate and display parts such as plate fins and heat dissipation plates

• You can register and reuse created parts to the library

Cutting out a PCB
• Create a PCB of arbitrary shape by cutting out

• Check the layout of components in 3D

Setting wiring pattern coverage ratio
• Specify the area by rectangle and polygon

Placing thermal vias
• Specify through hole and IVH
• Specify filled via

Setting mounting environment
• Mount horizontally/vertically Consider forced air cooling and radiation

Displaying each layer
• Specify through hole and IVH
• Check each layer by selecting a focused layer

Calculation and result display

Real-time display
• Check component translation in real time

Report output
• Specify through hole and IVH
• Output analysis results as reports

Alert function
• You can check parts whose temperature is higher than threshold

Linking with thermo-fluid analysis
• Specify through hole and IVH
• Output CAB file for scSTREAM or HeatDesigner

System configuration

Compliant OS Recommended environment
Windows 10
Windows 8.1
Windows Server 2016
Windows Server 2012 R2
Windows Server 2012
RedHat Enterprise Linux 7 *1
RedHat Enterprise Linux 6 (6.1 onward) *1
SUSE Linux Enterprise Server 12 *1
SUSE Linux Enterprise Server 11 *1
*1 Supports license manager only

2.0 GB or more

[Hard disk]
0.5 GB or more free capacity recommended

[Desktop resolution]
1920 x 1080 or greater

Software details

PICLS LT is now available! Please learn more, HERE!!
Contact the sales location in your area for any inquiries.

License PICLS
Types Floating
Main functions PICLS
Multiple layers Up to 16 layers
Wiring area specification Available
Thermal via Available
3D preview Available
Displaying each layer Available
Cutting out a PCB Available
Real-time display Available
Automatic report output Available
Forced air cooling Available
Radiation Available
Contact thermal resistance Available
Temperature margin, alert function Available
IDF3.0 interface Available
Considering a heatsink Available
Consideration of simple enclosure Available
Library Available
Wiring data (Gerber) import Available
Drill data import Available