PICLS
Features
The thermal simulation tool for printed circuit boards
Generates results real-time through easy and quick operation in 2D
PICLS is a thermal simulation tool specially designed for thermal simulation of PCBs. PCB modeling can be done easily through simple and quick operation in 2D like E-CAD using layers and PCB manipulating tool. You can import E-CAD data to perform thermal analyses from day 1.
Real-time results
Using typical thermal analysis tools, longer time is required to calculate and attain simulation results. With PICLS, one click and analysis results can be generated real-time. Through simple setting and fast calculation, thermal distribution can be shown on the spot to evaluate effectiveness of thermal countermeasures.
Front loads thermal design processes
PICLS is a simulation tool for designers to perform thermal analyses during upstream design process. Software Cradle’s PICLS is designed to minimize the tasks on design engineers in upstream design phase. Using the tool, design engineers can perform thermal analyses of PCBs during conceptual phase of the development, where drastic design changes are still possible.
High performance
The concept of PICLS is to deliver high capability at low cost. PICLS is a perfect tool that can be installed and maintained without difficulty, which is designed to promote more PCB designers to undertake thermal analyses and achieve better product design.
Functions
Thermal countermeasures using PICLS
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Modelling
External file interface
・You can import IDF 3.0 and Gerber data
Consideration of simple enclosure
• You can consider heat dissipation by connection to enclosure
Heatsink
• You can allocate and display parts such as plate fins and heat dissipation plates
Library
• You can register and reuse created parts to the library
Cutting out a PCB
• Create a PCB of arbitrary shape by cutting out
Preview
• Check the layout of components in 3D
Setting wiring pattern coverage ratio
• Specify the area by rectangle and polygon
Placing thermal vias
• Specify through hole and IVH
• Specify filled via
Setting mounting environment
• Mount horizontally/vertically Consider forced air cooling and radiation
Displaying each layer
• Specify through hole and IVH
• Check each layer by selecting a focused layer
Calculation and result display
Real-time display
• Check component translation in real time
Report output
• Specify through hole and IVH
• Output analysis results as reports
Alert function
• You can check parts whose temperature is higher than threshold
Linking with thermo-fluid analysis
• Specify through hole and IVH
• Output CAB file for scSTREAM or HeatDesigner
System configuration
| Compliant OS | Recommended environment |
| Windows 10 Windows 8.1 Windows Server 2016 Windows Server 2012 R2 Windows Server 2012 RedHat Enterprise Linux 7 *1 RedHat Enterprise Linux 6 (6.1 onward) *1 SUSE Linux Enterprise Server 12 *1 SUSE Linux Enterprise Server 11 *1 *1 Supports license manager only |
[Memory] [Hard disk] [Desktop resolution] |
Software details
PICLS LT is now available! Please learn more, HERE!!
Contact the sales location in your area for any inquiries.
| License | PICLS | PICLS LT |
| Types | Floating | - |
| Main functions | PICLS | PICLS LT |
| Multiple layers | Up to 16 layers | Up to 16 layers |
| Wiring area specification | Available | Available |
| Thermal via | Available | Available |
| 3D preview | Available | Available |
| Displaying each layer | Available | Available |
| Cutting out a PCB | Available | Available |
| Real-time display | Available | Available |
| Automatic report output | Available | Available |
| Forced air cooling | Available | Available |
| Radiation | Available | Available |
| Contact thermal resistance | Available | Available |
| Temperature margin, alert function | Available | Available |
| IDF3.0 interface | Available | - |
| Considering a heatsink | Available | - |
| Consideration of simple enclosure | Available | - |
| Library | Available | - |
| Wiring data (Gerber) import | Available | - |
| Drill data import | Available | - |
