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HeatDesigner is a structured (Cartesian) mesh thermal fluid analysis software specially designed for electronics cooling thermal analysis. It uses core technology from Software Cradle's scSTREAM general purpose structured mesh thermal-fluid software product.
HeatDesigner's performance is optimized for applications that do not require precise reproduction of fine geometrical curvature to predict an accurate flow field. However, HeatDesigner is capable of accommodating meshes with over a hundred million elements enabling it to capture fine geometrical details. Like scSTREAM, the major advantages of HeatDesigner are fast calculations times and low memory consumption.
Download a pdf brochure on thermo-fluid analysis software developed and provided by Software Cradle.
[PDF 3.01MB｜Updated:
February
2018]
In structured mesh, even a complicated model does not need to be modified almost at all and the shape or the scale of a model does not affect the difficulty of mesh generation. In addition, Solver performs a calculation at a high speed in parallel computing and achieves effective processing as the speed increases depending on the number of subdomains.
Mesh can be refined partially to represent a model shape more accurately and perform a calculation more efficiently.
Complicated conditions including trigonometric functions and conditional branches such as IF statements can be set without compiling.
The shapes and conditions of frequently used parts can be registered. Conditions include the allocation position, material, and heat generation.
The Delphi model (multiple-resistor model) enables highly accurate calculation.
The performance characteristics of a Peltier-device model can be considered for calculation.
P-Q characteristics and swirling components can be considered for calculation without creating the shape of a fan.
The pressure loss of a part can be considered for calculation only by setting its opening ratio.
Heat transfer from a heat source to a heat-releasing part by using a heat pipe is modeled and the model can be used for calculation.
The shapes of pin fins and plate fins can be created easily by specifying parameters.
The information on temperature of each part and a comprehensive amount of heat release obtained in post-processing of a general CFD analysis is not enough to know the heat path. HeatPathView displays heat paths and the amount of heat transfer in the whole computational domain in a diagram, a graph, and a table, allowing you to find the bottleneck of the heat paths easily.
To calculate heat transfer conditions depending on wiring patterns of a printed circuit board (PCB) in detail, the module can read Gerber data output from an electric CAD tool and import the data as a model for a thermo-fluid analysis. By using Gerber data, a more realistic calculation result can be obtained with the consideration of heat transfer affected by an uneven wiring pattern.
By setting temperature difference and emissivity between objects, heat transfer by radiation of infrared rays, for example, can be considered using VF (view factor) method. Transmission, absorption, diffusion, refraction and reflection of radiant rays can also be considered.
- Thermal Analysis is Beneficial for the Design of Food Contaminant Scanners
- Usability was a Deciding Factor in Choosing HeatDesigner for the Analysis Tool
- Real-time Solutions for Thermal Problems
- Key to Success is a Workplace Environment Where Design Engineers Can Promptly Implement Their Ideas
Helping Local Companies Solve Thermal Issues with CFD Tools
Combining Tests and CFD Analysis to Solve Long Standing Issues
Key to Success: Creating an environment in which engineers can objectively evaluate analysis results
Successful Implementation of Thermo-Fluid Analysis in Car Navigation System Design
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