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Heat release of circuit board

For high density packages and downsized products, heat sinks, cooling path, and securing space for the cooling path are important parts of the electronics development. Also, the wiring pattern and through hole location affects heat release patterns and the heat release rate.


In a typical thermal-fluid analysis, the mesh is generated to prepare for a calculation. The mesh depends on the model geometry, and complicated geometries increase the number of mesh elements and increase the time to generate the mesh . However, a model properly simplified can provide adequate results during the initial stages of the design process and shorten the work period.


HEAT Designer can provide analysis of printed circuit board with wiring patterns. Cooling effectiveness can be studied by adjusting the location of thermal holes and changing the material of circuit board.


  • Electronic devices with PWA
  • Printed-wiring assembly(PWA)

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