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Heat release from small sized electronic products

Solution

Contemporary electronic devices discharge more heat than their predecessors. Efficient and effective heat release is essential for product life and performance; however, cooling can be very limited due to the high density packaging. To identify an optimized design, many design variations should be reviewed as quickly as possible.

Merit/Benefit

Thermo-fluid analysis is superior to experiments in terms of the number of design options that can be evaluated in a short period of time. When done properly, CFD can reduce development costs associated with design modification or redesign by cutting time out of the design process.

Subject/Scope

  • Appliances(TV, Audio)
  • Office equipment(copy machine)
  • Car equipment(GPS navigation)

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