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HeatDesigner

Features

HeatDesigner is a structured (Cartesian) mesh thermal fluid analysis software specially designed for electronics cooling thermal analysis. It uses core technology from Software Cradle's scSTREAM general purpose structured mesh thermal-fluid software product.
HeatDesigner's performance is optimized for applications that do not require precise reproduction of fine geometrical curvature to predict an accurate flow field. However, HeatDesigner is capable of accommodating meshes with over a hundred million elements enabling it to capture fine geometrical details. Like scSTREAM, the major advantages of HeatDesigner are fast calculations times and low memory consumption.

HeatDesigner

Program Structure

Large-scale calculation

Large-scale calculation

In structured mesh, even a complicated model does not need to be modified almost at all and the shape or the scale of a model does not affect the difficulty of mesh generation. In addition, Solver performs a calculation at a high speed in parallel computing and achieves effective processing as the speed increases depending on the number of subdomains.

Parametric study

Parametric study

Parametric Study Tool is useful to apply multiple conditions to multiple parts and compare the analysis results. The tool automatically performs calculation the required number of times only by specifying the number of conditions and the parameters of the conditions. Multiple analysis results of different conditions can be obtained easily by setting parameters simply at the early stage. In addition, the tool can reduce human errors, which tend to be caused when multiple models are created.

Customizing variables

Customizing variables

Complicated conditions including trigonometric functions and conditional branches such as IF statements can be set without compiling.

Part library

Part library

The shapes and conditions of frequently used parts can be registered. Conditions include the allocation position, material, and heat generation.

Thermal circuit model

Thermal circuit model

The Delphi model (multiple-resistor model) enables highly accurate calculation.

Peltier-device model

Peltier-device model

The performance characteristics of a Peltier-device model can be considered for calculation.

Fan model

Fan model

P-Q characteristics and swirling components can be considered for calculation without creating the shape of a fan.

Slit punching model

Slit punching model

The pressure loss of a part can be considered for calculation only by setting its opening ratio.

Heat pipe model

Heat pipe model

Heat transfer from a heat source to a heat-releasing part by using a heat pipe is modeled and the model can be used for calculation.

Heat sink

Heat sink

The shapes of pin fins and plate fins can be created easily by specifying parameters.

HeatPathView

HeatPathView

The information on temperature of each part and a comprehensive amount of heat release obtained in post-processing of a general CFD analysis is not enough to know the heat path. HeatPathView displays heat paths and the amount of heat transfer in the whole computational domain in a diagram, a graph, and a table, allowing you to find the bottleneck of the heat paths easily.

ElectronicPartsMaker

ElectronicPartsMaker

The tool is provided free of charge (partially optional). The tool can create detailed models of semiconductor packages including QFP, SOP, and BGA by specifying parameters, and simplified models using thermal resistor models such as Delphi models and two-resistor models. Manufacturers of semiconductor packages can provide the data of semiconductor packages as thermal resistor models without releasing the inside information. For details, please refer to Download ElectronicPartsMaker.
Reading wiring patterns

Reading wiring patterns

To calculate heat transfer conditions depending on wiring patterns of a printed circuit board (PCB) in detail, the module can read Gerber data output from an electric CAD tool and import the data as a model for a thermo-fluid analysis. By using Gerber data, a more realistic calculation result can be obtained with the consideration of heat transfer affected by an uneven wiring pattern.

Radiation

Radiation

By setting temperature dierence and emissivity between objects, heat transfer by radiation of infrared rays, for example, can be considered. VF (view factor) method and FLUX method can be used. Transmission, absorption, and reection of radiant rays can also be considered. The directivity of radiant rays can also be considered in FLUX method.

Product Configuration

HeatDesigner[HEATpre/HEATsolver/HEATpost]
LFileView A viewer tool for L files in text format that collects data at each solver calculation cycle.
HEATtools A tool for reprocessing calculation results data files.
CradleViewer A license free viewer for visualizing calculation results generated by the solvers in Cradle products.
HeatPathView An assessment tool for thermal analyses with graphical illustrations of heat paths.
scWorksketch A tool that automates the generation and execution of tasks by connecting programs on flow charts
ElectronicPartsMaker A tool to design semiconductor package parts (partially optional).
BMP2AVI A tool that converts multiple BMP files into a single AVI file.
CADaddinTool An add-in tool for SolidWorks® , which enables setting analysis conditions for scSTREAM/HeatDesigner within SolidWorks® .
PreCSVTool PreCSVTool is a tool that helps automatic, collective setting of material properties and analysis conditions.
User's Guide (electronic version)
Sample Data

* All provided upon installation (downloaded from the Web).

Application Examples
Nagoya Municipal Industrial Research Institute

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Helping Local Companies Solve Thermal Issues with CFD Tools

  • STREAM
  • 熱設計PAC
  • SCRYU/Tetra
National Defense Academy of Japan

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Combining Tests and CFD Analysis to Solve Long Standing Issues

  • STREAM
  • 熱設計PAC
  • SCRYU/Tetra
SAXA Inc.

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Key to Success: Creating an environment in which engineers can objectively evaluate analysis results

  • STREAM
  • 熱設計PAC
Alpine Electronics, Inc.

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Successful Implementation of Thermo-Fluid Analysis in Car Navigation System Design

  • STREAM
  • 熱設計PAC

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