| Computer Casing |
| Thermal analysis of electric devices is an indispensable operation
for determining operational stability. It is especially important for high-speed and miniaturized electronic devices. The analysis should consider the
diverse range of operating conditions. It should also include heat conduction within the parts, the air flow inside the case and the exhaust path to prevent hot
air from being trapped inside the cabinet. Using a combination of HEAT Designer and
scSTREAM, various combinations of fans and opening positions can be compared. |
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| Power Supply Unit |
| The power supply unit which transforms voltage emits large amounts of
heat. Heat is dissipated by both forced convection from fans and natural convection. HEAT Designer stably computes natural heat
dissipation cases using predetermined calculation parameters for electrical and electronics equipment. |
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| Heat Sink I |
| Predicting the performance of a single heat sink is a common first step to
thermal simulation. Thermal conduction is influenced by the spacing and thickness of the fins, and the heat-transfer coefficient is influenced by the air velocity over
the fin surface. |
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| Heat Sink II |
Some heat sinks are integrated with a fan. SC/Tetra can be used for simulating these
systems by including the fan rotation model, a primary source of cooling.
The steady state performance of the heat sink is calculated quickly. Fan rotation introduces a transient component. |
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| Electronics Device |
| Electronics device and circuit board thermal conduction can be conducted using CFD. The
Software Cradle CFD product suite enables computation of the heat flux to the circuit board while also considering the internal structure of the electronics
device. Even the wiring pattern of the circuit board can be considered in the thermal conductance analysis. |
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| Car Audio and Navigation Systems |
| Car audio and Navigation systems generate a significant amount of heat. This subjects
the inside of the automotive dashboard to extremely high temperatures. Optimum system integration dictates appropriate analysis of the potential thermal problem. HEAT Designer
and scSTREAM are suitable tools for this analysis which requires a high degree of accuracy. Both HEAT Designer and
scSTREAM efficiently handle large models which is needed
for resolving fine geometric details. |
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| Pyrostat and Furnace |
A reflow furnace is precisely controlled to maintain a uniform temperature over a
defined period of time.
scSTREAM can evaluate the temperature dissipation on a circuit board in relation to the geometric arrangement of the air outlets.
scSTREAM can calculate the air velocity and
the resultant temperatures that comes from moving the circuit boards. |
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Innovative CFD-ware for Product Design
